TETRAPOL appeared in the late 1980s to provide digital voice and low data rate data mobile radio-communications. Wilmuth Müller, in Wireless Public Safety Netwo3.2.2 TETRAPOL When the transmitted bit stream includes periodically repeated components (e.g., the GSM/EDGE 26-symbol midamble), further cyclic features of both types are generated. Moreover, for GSM, there is also a large number of conjugate features. It can be shown mathematically that this combination produces a great number of non-conjugate cyclic features even if the base modulation type is stationary. In both GSM and EDGE, the base modulation is combined with the access mode, in this case an eight-slot TDMA scheme per RF carrier. Therefore, the base modulation for EDGE is a second-order stationary signal.
Moreover, 8PSK and 3 π/8-8PSK do not exhibit any conjugate spectral correlation. The transmitter filtering reduces the non-conjugate set of CFs to just -the PSD. So for a GSM signal at complex baseband, we have f c = 0 and the two CFs are ± 135.4 kHz.įor EDGE, the basic modulation type is a variant of 8PSK called 3 π/8-8PSK and the EDGE system uses a transmitter pulse-shaping filter that spectrally shapes the signal so that it can fit into the standard 200 kHz wide GSM channels. For a GMSK signal with symbol rate of F sym and carrier offset of f c, when viewed as an offset QPSK signal, the non-conjugate CFs have negligible-strength SCF, and the conjugate CFs are 2 f c ± F sym. I.The base modulation type of GMSK (GSM and GPRS) exhibits detectable spectral correlation. Index Terms-3-D IC interconnect, CDMA DRAM, CDMA-interconnect (CDMA-I), FDMA-interconnect (FDMA-I), FDMA DRAM, inter/intra-ULSI communications, multilevel signal clock data recovery, multicarrier DCMA-Interconnect (MCCDMA-I), realtime re-configurable interconnects, RF-interconnect (RF-I), re-configurable interconnect for next-generation systems (RINGS), simultaneous and bidirectional multiI/O service. These new advances in interconnect schemes would fundamentally alter the paradigm of ULSI data communications and enable the design of next-generation computing/processing systems. Rather, it can be accomplished via either wired or wireless mediums through capacitor couplers that reduce the baseband noise and dc power consumption while simplifying the fabrication process by eliminating vertical metal studs needed in three-dimensional ICs. The physical transmission line is no longer limited to a direct-coupled metal wire. Unlike traditional wired interconnects based solely on time-division multiple access for data transmission, these new interconnect schemes facilitate the use of additional multiple access techniques including code-division multiple access and frequency-division multiple access to greatly increase bandwidth and channel concurrency as well as to reduce channel latency.
In this paper, we review recent advances in interconnect schemes that promise to meet all of the above system requirements. Abstract-Future inter- and intra-ULSI interconnect systems demand extremely high data rates (up to 100 Gbps/pin or 20-Tbps aggregate) as well as bidirectional multiI/O concurrent service, re-configurable computing/processing architecture, and total compatibility with mainstream silicon system-on-chip and system-in-package technologies.